Physics-Electrodeposition-1.00

Documentation

Model metal electrodeposition (electroplating) on semiconductor wafers.

First-order copper electroplating model for Al/Ti seed layers

Dependency-free GDSII (Calma Stream) reader, writer and hierarchy flattener for electrodeposition pattern extraction.

Extract plating geometry (open area, pattern density, feature CD, loading non-uniformity) from a GDSII mask.

To install Physics::Electrodeposition, copy and paste the appropriate command in to your terminal.

cpanm Physics::Electrodeposition

perl -MCPAN -e shell
install Physics::Electrodeposition

For more information on module installation, please visit the detailed CPAN module installation guide.

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