Changes for version 0.01 - 2026-08-18
- Initial release of Physics::Etch and related model/toolkit modules.
- Added CPAN distribution scaffolding (Makefile.PL, metadata, manifest).
Documentation
Modules
model wet and dry semiconductor etch processes
plasma-etch reactor geometry and derived conditions
anisotropic plasma / RIE dry etch model
the chemistry used by an etch process
minimal GDSII stream reader / writer
mask-pattern geometry for etch modelling
macro / micro loading and ARDE (RIE-lag) models
a material (film, mask, or substrate) in an etch model
base class for wet and dry etch process models
pattern/chamber/loading-aware etch simulation
isotropic, temperature-activated wet etch model
Examples
- examples/etch_aluminum_silicide.pl
- examples/etch_chamber_geometry.pl
- examples/etch_copper.pl
- examples/etch_gdsii_simulation.pl
- examples/etch_loading_effect.pl
- examples/etch_photoresist_ash.pl
- examples/etch_photoresist_strip.pl
- examples/etch_polyimide.pl
- examples/etch_silicon_nitride.pl
- examples/etch_tantalum.pl
- examples/etch_titanium.pl
- examples/make_sample_mask.pl
- examples/sample_mask.gds