Changes for version 0.01 - 2026-08-18

  • Initial release of Physics::Etch and related model/toolkit modules.
  • Added CPAN distribution scaffolding (Makefile.PL, metadata, manifest).

Documentation

Modules

model wet and dry semiconductor etch processes
plasma-etch reactor geometry and derived conditions
anisotropic plasma / RIE dry etch model
the chemistry used by an etch process
minimal GDSII stream reader / writer
mask-pattern geometry for etch modelling
macro / micro loading and ARDE (RIE-lag) models
a material (film, mask, or substrate) in an etch model
base class for wet and dry etch process models
pattern/chamber/loading-aware etch simulation
isotropic, temperature-activated wet etch model